Xiaomi’s Next-Gen XRING O3 Chip Leak Points to Foldable Phone Debut
Xiaomi is reportedly preparing to launch its self-developed XRING O3 processor, with leaks suggesting it will debut inside the upcoming Xiaomi 17 Fold. The new chip appears in Mi Code under the codename “lhasa”, hinting at a design optimized for multitasking on foldable devices.
From XRING O1 to O3: Streamlined Core Design
Compared to the earlier XRING O1 with a 10-core layout, the XRING O3 is said to adopt a simplified 8-core design. The new setup combines:
- One prime core clocked at up to 4.05 GHz
- High-performance cores running at 3.42 GHz
- Efficiency cores surprisingly boosted to 3.02 GHz, far higher than the 1.79 GHz efficiency cores on XRING O1
This unusual jump in efficiency core speeds could significantly improve background tasks and app switching—critical for foldable phones where users often run multiple apps side by side.
Graphics and Memory Performance
On the GPU side, XRING O3 is rumored to hit 1.5 GHz, up from ~1.2 GHz in the previous generation. Memory bandwidth is expected to remain at 9600 MT/s, but the overall architecture changes should deliver smoother multitasking and better performance for large-screen foldables.
Possible Configurations
Reports suggest Xiaomi is still finalizing the exact core cluster arrangement, with options like 1+3+4 or 1+2+5 under consideration. This indicates the chip is still in development and subject to change before its official release.
Outlook
If the leaks hold true, Xiaomi’s XRING O3 could mark a major step in the company’s in-house silicon strategy, tailored specifically for foldable devices. By balancing raw performance with multitasking efficiency, the chip may give Xiaomi’s foldables an edge in a market where seamless multitasking is key.